Laser material processing is a widely used technique in the semiconductor industry for marking, engraving, and scribing various compounds such as wafers, epoxies, and crystals. With the use of laser marking systems, data such as serial numbers, barcodes, and logos can be etched onto these materials to ensure traceability and maintain quality control standards.

SCARA robot for semiconductor wafer handling
SCARA robot handling large wafer for laser marking serialization

Lasers for Semiconductors

The semiconductor wafer laser marking and engraving involves various operations such as serialization, patterning, and roughening. Choosing the appropriate laser system for these operations can be a challenging task considering the numerous process variables involved. These variables include substrate type, wafer diameter, feature size, slag tolerances, debris volume, throughput, and clean room protocols, which must all be carefully considered to ensure the best possible results.

At CMS Laser, we provide a comprehensive range of wafer laser marking and engraving solutions, including serialization for traceability, scribing, and lapping. Our laser systems are highly versatile and can process a wide variety of semiconductor substrates and coatings, such as silicon, sapphire, lithium tantalate, silicon carbide, III-V semiconductors, II-VI semiconductors, and photo resists. All our systems are designed and built in the USA.

Semiconductor Laser Applications


  • The UV Laser system (355nm) offers the best solution when process tolerances are the most important factor. This system allows geometries and line widths below 5 micron in dimensions and processing with minimal to no slag.


  • These systems produce less particulate than the CO2 Laser System and thus are acceptable for standard fabrication cleanrooms.



  • The CO2 Laser System offers an economical solution suitable for serialization and dicing for use in higher class cleanrooms, when larger geometries and line widths are acceptable and slag is not a major concern.


  • New ultrafast lasers offer true “cold marking” processes and excel in areas where nanosecond lasers fail. These lasers are ideal for certain processing requirements.
Wafer serialization done with laser marking system

Laser Marking Videos

Control Micro Systems Expands Laser Applications Lab Capabilities

The Absolute Best Customer Service Around

Working with the entire Control Micro Systems team on our project was a pleasure. CMS was capable of meeting and exceeding our goals. They successfully designed and built a machine which increased our throughput by 550%! We are so glad we chose to move forward with CMS.

Jim B., Custom Wire Technologies, Inc.

In the three years ACR has owned the CMS laser, it has worked flawlessly. In the few instances where ACR needed support in programming, CMS was quick to respond.

Mike S., ACR Electronics, Inc.

CMS have been excellent partners in the development of new, complex equipment for our business. CMS built multiple machines for us. Each machine had a different purpose, however the CMS team worked openly & honestly with us to agree on optimal solutions for each one.

Andy, Confidential

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